PS-670 can build Point to Point (P2P) or Point to Multi-Point (P2MP) architectures comprising of the compact Central Office (CO) system and multiple Customer Premises Equipment (CPE) units. Each CPE unit, connecting to the CO unit, bonds 1 to 8 copper pairs together to create a single logical link which can obtain service of up to 40Mbit/s payload data rate. The performance of service depends on the loop length, wire gauge, and number of available pairs, allowing service providers to maximize the throughput.

The PS-670 bonding scheme complies with IEEE 802.3ah section 61, and the PS-670 operation and performance of multiple copper pairs are based on ITU-T Rec. G.991.2 for enhanced Single-pair High-bit-rate Digital Subscriber Line (SHDSL).